Dr. Amanda Eisinger

Investigative Dermatology Research Fellow (2020-2021)

“My path to dermatology is the direct result of my experience as both having been a patient with a serious skin condition as well as a caretaker for my mother with a more advanced form of the same disease. When I reflect on these experiences I am grateful that we were treated by intelligent and compassionate physicians. This defined the doctor I aspire to be and the empathic care I try to deliver on a daily basis.  Dermatology, including the treatment of women with hair and scalp issues, is an opportunity for me to form meaningful and long-lasting relationships with patients. It allows me to further a philosophy both my mom and I shared through our treatment: self-confidence and overall improved mental health are intimately connected to physical health. It is an honor to help women understand their hair loss and to improve their self-image as they make treatment decisions. 

I was born and raised in New York City. I traveled farther north for college and graduated from Brandeis University with a BA in Psychology. Following my post-baccalaureate premedical studies, I spent several years working at Memorial Sloan Kettering Cancer Center where I gained experience in clinical research and administration. Specifically, I managed several clinical research protocols for women living with gynecologic malignancies. I attended the New York Institute of Technology College of Osteopathic Medicine. As a future dermatologist, I am grateful to partner with and learn from our fantastic patients.”

Amanda Eisinger, DO

Education and Training

Brandeis University (BA, cum laude) 
Memorial Sloan Kettering Cancer Center (research) 
New York Institute of Technology College of Osteopathic Medicine (DO)  
Pilaris Dermatology (Research Fellowship)  

Selected Awards

Translating Osteopathic Understanding Into Community Health (TOUCH) Gold Award 
College of Osteopathic Student Government Presidents Winter Research Symposium Travel Grant

Languages

English, Hebrew 

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